Bergquist-Sil-Pad-900S-Thermally-Conductive-Low-pressure-Insulating-Material-Bergquist-BG400754-p-A-high-performance-thermally-conductive-material-for-applications-requiring-high-thermal-conductivity-the-pads-can-be-applied-to-either-the-heatsink-or-the-device-and-are-specifically-designed-for-low-mounting-pressure-applications-clip-mount-pads-have-no-fixing-holes-p-Bergquist-BG400754-Pk10-SIL-pad-900-s-TO220-no-Holes-
Bergquist-Gap-Pad-2000S40-Thermally-Conductive-Gap-filling-Material-Bergquist-GP2000S40-0-040-02-0404-P-Gap-Pad-2000S40-is-a-highly-conformable-reinforced-gap-filling-material-from-Bergquist-that-provides-high-thermal-conductivity-at-very-low-mounting-pressures-This-grey-material-is-electrically-isolating-and-is-suitable-for-isolation-between-heat-sinks-and-bare-leaded-high-voltage-devices-P-P-Fibreglass-reinforcement-of-the-material-enables-easier-handling-and-superior-puncture-she