Contact spacing: 5 mm; Inductance (L): 4.7 µH; Material: Duplex steel; Nominal current: 4 A; Tolerance (+/-): 20 %; Type (resistor/capacitor): Radial lead
Contact spacing: 5 mm; Inductance (L): 68 µH; Material: Duplex steel; Nominal current: 1.1 A; Tolerance (+/-): 10 %; Type (resistor/capacitor): Radial lead
Contact spacing: 5 mm; Inductance (L): 6.8 µH; Material: Duplex steel; Nominal current: 3.8 A; Tolerance (+/-): 20 %; Type (resistor/capacitor): Radial lead
Copper wire winds, side metallisation and gold-plated connections for reliable SMD-Reflow soldering properties, plane suction surface.
Copper wire winds, side metallisation and gold-plated connections for reliable SMD-Reflow soldering properties, plane suction surface.
Copper wire winds, side metallisation and gold-plated connections for reliable SMD-Reflow soldering properties, plane suction surface.
Copper wire winds, side metallisation and gold-plated connections for reliable SMD-Reflow soldering properties, plane suction surface.
Copper wire winds, side metallisation and gold-plated connections for reliable SMD-Reflow soldering properties, plane suction surface.
Copper wire winds, side metallisation and gold-plated connections for reliable SMD-Reflow soldering properties, plane suction surface.
Copper wire winds, side metallisation and gold-plated connections for reliable SMD-Reflow soldering properties, plane suction surface.