Fischer Elektronik 10035045 FK 250 06 LF PAK Heat sink 37 K/W (L x W x H) 8 x 15 x 6.5 mm DPAK, LF-PAK
Copper heat sink with extraordinary heat conductivity Direct mounting of conducting board by solder-able surface
Fischer Elektronik 10035047 FK 250 08 LF PAK Heat sink 34.8 K/W (L x W x H) 8 x 15 x 8 mm DPAK, LF-PAK
Copper heat sink with extraordinary heat conductivity Direct mounting of conducting board by solder-able surface
Fischer Elektronik 10035049 FK 250 10 LF PAK Heat sink 28.8 K/W (L x W x H) 8 x 15 x 10 mm DPAK, LF-PAK
Copper heat sink with extraordinary heat conductivity Direct mounting of conducting board by solder-able surface
Fischer Elektronik 10035051 FK 251 06 LF PAK Heat sink 32 K/W (L x W x H) 13 x 15 x 6.5 mm DPAK, LF-PAK
Copper heat sink with extraordinary heat conductivity Direct mounting of conducting board by solder-able surface
Fischer Elektronik 10037017 ICK 6/8 L Heat sink 83 K/W (L x W x H) 8.5 x 6.3 x 4.8 mm DIL 6, DIL 8
These heatsinks have been specially developed for cooling ICs in a DIL housing. (Essential for more powerful ICs)
Fischer Elektronik 10037021 ICK BGA 14 X 14 Heat sink 29 K/W (L x W x H) 14 x 14 x 6 mm
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Fischer Elektronik 10037026 ICK BGA 23 X 23 Heat sink 22 K/W (L x W x H) 23 x 23 x 6 mm
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Fischer Elektronik 10037030 ICK BGA 27 X 27 X 10 Heat sink 18.5 K/W (L x W x H) 27 x 27 x 10 mm
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Fischer Elektronik 10037032 ICK BGA 27 x 27 x 22 Heat sink 13.5 K/W (L x W x H) 27 x 27 x 22 mm
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Fischer Elektronik 10037034 ICK BGA 31 X 31 X 10 Heat sink 17 K/W (L x W x H) 31 x 31 x 10 mm
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.